In this paper, we present a new hybrid method for constructing thin, rigid and free-form interconnected surfaces via fused deposition modelling (FDM) 3D printing and vacuum-forming. Hybrid additive manufacturing techniques like thermoforming are becoming popular for prototyping freeform electronics given its design flexibility, speed and cost-effectiveness. Integrating advanced functionality, which may include sensing, computation and communication, within thin structures is desirable for various next-generation interactive devices. Vacuum-forming is ubiquitous in packaging and casing products in industry spanning fast moving consumer goods to connected devices. Vacuum-forming is a common manufacturing technique for constructing thin plastic shell products by pressing heated plastic sheets onto a mold using atmospheric pressure.
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